Micro device arrangement in donor substrate
US11892497B2 · kind B2 · utility
1Cited by
5References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2023 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Mar 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1304
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.