Electronic device comprising bonding layer in contact with active area of digitizer
US11893196B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2022 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Jul 28, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04102
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device including a bonding layer in contact with an active area of a digitizer may include: the digitizer, a main magnet attached to a surface of the digitizer, a flexible printed circuit board electrically connected to the digitizer, and a bonding layer connecting the digitizer and the flexible printed circuit board, wherein the flexible printed circuit board includes a base part overlapping the bonding layer with respect to a stacking direction of the digitizer, the flexible printed circuit board, and the bonding layer, and extension parts extending toward the main magnet from the base part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.