Process for manufacturing a chip-card module with soldered electronic component
US11894295B2 · kind B2 · utility
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1References
7Claims
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Key dates
| Filing date | Oct 25, 2021 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Nov 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Process for manufacturing a chip-card module. It includes one or more operations in which a meltable solder is deposited on connection pads formed in a layer of electrically conductive material located on the back side of a dielectric substrate, and at least one electronic component is connected to these connection pads by reflowing the solder. Chip-card module obtained using this process. Chip card including such a module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.