Patent · US Active

Electronic system in package comprising protected side faces

US11894315B2 · kind B2 · utility

0Cited by

2References

6Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Thibaut SOHIER · Grenoble, FR
Stephan Borel · Crolles, FR

Key dates

Filing date	Oct 12, 2021
Grant date	Feb 6, 2024
Priority date	—
Expiry date	Nov 29, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/16251
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic system in package, including at least:a support;one or more chips mechanically and electrically coupled to a front face of the support;an encapsulation material covering the front face of the support and encapsulating the chip(s);several side protection elements, comprising an opaque material and laterally surrounding the chip(s) and configured to form a barrier at least against laser attacks made through side faces of the electronic system in package that are substantially perpendicular to the front face of the support;and wherein the side protection elements are disposed in the encapsulation material or in one or more first blocks of material distinct from the support and disposed in the encapsulation material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.