Launch structures for radio frequency integrated device packages
US11894322B2 · kind B2 · utility
0Cited by
48References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2019 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Jul 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Radio frequency integrated device packages having bump and/or ball launch structures are disclosed herein. The bump launch structures can comprise patterned metallic and insulating material that substantially matches the impedance of a radio frequency integrated device die. The ball launch structures can comprise patterned metallic and insulating material that substantially matches the impedance of a system board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.