Patent · US Active

Millimeter-wave radar package module

US11894601B2 · kind B2 · utility

0Cited by

9References

7Claims

0Family size

Assignee

8TH RESEARCH INSTITUTE, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION · CN

Inventors

Zongming Duan · Daguantang, CN
Chuanming Zhu · Daguantang, CN
Ying LIU · Daguantang, CN
Bowen Wu · Suzhou, CN
Weiwei Jin · 安丰镇, CN
Bingfei Dou · Daguantang, CN
Yuefei Dai · Daguantang, CN

Key dates

Filing date	Mar 19, 2021
Grant date	Feb 6, 2024
Priority date	—
Expiry date	Aug 12, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG01S7/028
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Provided is a millimeter-wave radar package module, which relates to antenna packaging. The millimeter wave radar package module includes a package and a plurality of antenna units packaged therein. The package includes a chip, and the chip includes a transmitter and a receiver. The antenna units are respectively connected to an output pin of the receiver and an output pin of the transmitter through a transmission line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.