Printed circuit board substrate comprising a coated boron nitride
US11895768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2019 |
| Grant date | Feb 6, 2024 |
| Priority date | — |
| Expiry date | Nov 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0293
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an embodiment, a printed circuit board substrate (12) comprises a polymer matrix; a reinforcing layer (42); and a plurality of coated boron nitride particles (44); wherein the plurality of coated boron nitride particles comprise a coating having an average coating thickness of 1 to 100 nanometers. The polymer matrix can comprise at least one of an epoxy, a polyphenylene ether, polystyrene, an ethylene-propylene dicyclopentadiene copolymer, a polybutadiene, a polyisoprene, a fluoropolymer, or a crosslinked matrix comprising at least one of triallyl cyanurate, triallyl isocyanurate, 1,2,4-trivinyl cyclohexane, trimethylolpropane triacrylate, or trimethylolpropane trimethacrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.