Mold plate cooling arrangement
US11897175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2020 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Oct 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/2673
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A fluid cooled mold plate is disclosed. The fluid cooled mold plate has a front side, a rear side, and a perimeter that extends between its front and rear sides. A cooling chamber is formed within the mold plate. The cooling chamber has a front wall, a rear wall, and a perimeter wall that extends between the front and rear walls. An inlet fluid duct extends from a first side of the mold plate perimeter to a first end of the cooling chamber and an outlet fluid duct extends from a second side of the mold plate perimeter to a second end of the cooling chamber. The cooling chamber is occupied by a turbulence generating dispersion mesh that is secured between the front and rear walls the cooling chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.