Frequency domain spatial packing for 3D fabrication
US11897203B1 · kind B1 · utility
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Key dates
| Filing date | Sep 29, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Sep 29, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Arrangement of the parts, particularly addressing arrangement for 3D fabrication, makes use of spatial frequency domain representations of the parts, such that acceptable (or optionally desirable) relative locations (and optionally orientations) of a part relative to another part or an arrangement of multiple other parts makes use of spatial frequency domain representations of the parts. In some examples, acceptable relative locations may be defined as relative locations that do not result in parts spatially overlapping and/or maintain a desired (e.g., minimum, average, etc.) separation between parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.