Laser-based support structure removal
US11897205B2 · kind B2 · utility
0Cited by
63References
20Claims
0Family size
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Key dates
| Filing date | Jun 2, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Jun 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7536
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems and methods for fabricating a dental aligner are provided. The system includes a computing system to receive and prepare a digital model of a dental aligner by adding one or more support structures to the digital model. The system includes a fabrication system to manufacture the dental aligner with the one or more support structures. The system includes a laser system to receive the fabricated dental aligner, orient the dental aligner relative to the laser system, and laser cut an interface between the support structures and the dental aligner to remove the one or more support structures from the dental aligner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.