Patent · US Active

Electrical contacting and method for producing an electrical contacting

US11897758B2 · kind B2 · utility

0Cited by

0References

15Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Reinmuth · Reutlingen, DE
Markus Kuhnke · Wannweil, DE
Stefan Majoni · Holzgerlingen, DE
Timo Schary · Grötzingen, DE

Key dates

Filing date	Jun 25, 2019
Grant date	Feb 13, 2024
Priority date	—
Expiry date	May 12, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/095
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

An electrical contacting between a surrounding wiring and a conductor region. The conductor region is situated in a conductor layer above an SOI wafer or SOI chip. A cover layer is situated above the conductor layer and below the surrounding wiring. The cover layer has a contacting region. The contacting region is insulated from the rest of the cover layer by a first configuration of recesses. An opening is formed at least in the contacting region. A metallic material is situated in the opening. The metallic material connects the surrounding wiring and the conductor region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.