Resin composition and article made therefrom
US11897973B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Aug 2, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/5399
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.