Reactive 2-component adhesive system in film form having improved heat-and-humidity resistance
US11898067B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Nov 22, 2017 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Jan 10, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2475/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a reactive adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from an initiator, in particular a radical initiator, or an activator, featuring enhanced heat-and-humidity resistance, and to a reactive 2-component adhesive system in film form for bonding diverse materials, such as, for example, metal, wood, glass and/or plastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.