High thermal conductivity aluminum alloy and preparation method thereof
US11898224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2019 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Jan 12, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C1/1073
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides a high thermal conductivity aluminum alloy, which comprises the following components in percentage by weight: Al: 80%-90%; Si: 6.5%-8.5%; Fe: 0.2%-0.5%; Zn: 0.8%-3%; V: 0.03%-0.05%; Sr: 0.01%-1%; graphene: 0.02%-0.08%. In the high thermal conductivity aluminum alloy of the present invention, alloying elements including Si, Fe, and Zn are optimized; Sr, V, graphene, among others are added. The amount of each component is controlled so that they coordinate to ALLOW high thermal conductivity, good casting performance and excellent semi-solid die-casting property. Graphene is introduced to the high thermal conductivity aluminum alloy of the present invention to exploit the good thermal conductivity of graphene, allowing the formation of a high thermal conductivity aluminium alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.