Merged infrastructure for manufacturing and lifecycle management of both hardware and software
US11899549B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Mar 15, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3089
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A merged infrastructure for manufacturing and lifecycle management of both hardware and software is disclosed. In various embodiments, a library comprising a superset of device drivers is stored, the superset including for each of a plurality of supported systems a corresponding set of device drivers for devices comprising that supported system. A context in which a processor is deployed is determined, the context being associated with a specific corresponding one of the plurality of supported systems. The library is used to provision based on the determined context at least a subset of devices accessible by the processor in the context in which the processor is deployed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.