Multi-dimensional cache architecture
US11899583B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2021 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Jul 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L49/109
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various implementations described herein are directed to a device with a multi-layered logic structure with multiple layers including a first layer and a second layer arranged vertically in a stacked configuration. The device may have a first cache memory with first interconnect logic disposed in the first layer. The device may have a second cache memory with second interconnect logic disposed in the second layer, wherein the second interconnect logic in the second layer is linked to the first interconnect logic in the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.