Touchpad module and computing device using the touchpad module
US11899857B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2023 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04105
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touchpad module includes a base plate, a touch member, a supporting structure and a pressure sensing unit. The touch member is movable toward the base plate. The supporting structure is arranged between the base plate and the touch member. The pressure sensing unit is installed on the touch member. The pressure sensing unit is arranged between the touch member and the base plate. While the touch member is pressed in response to an external pressing force, the touch member is moved downwardly toward the base plate to compress the supporting structure. Consequently, the supporting structure is subjected to deformation, and the touch member has a displacement amount. According to the displacement amount, a magnitude of the pressing force is sensed by the pressure sensing unit, and a pressure sensing signal is outputted from the pressure sensing unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.