Systems-in-packages having multiple shielding components
US11900197B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2021 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Dec 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/1058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods are disclosed for systems-in-packages that have multiple shielding components. In one embodiment, a system-in-package may include a substrate, an integrated circuit package disposed on the substrate, a system-on-a-chip disposed on the substrate, and a molding compound disposed over the integrated circuit package and the system-on-a-chip. The system-in-package may include a first electromagnetic interference shielding component disposed about the molding compound, and a second electromagnetic interference shielding component that at least partially forms an outer surface of the system-in-package. The second electromagnetic interference shielding component may have a patterned structure formed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.