Surface profile estimation and bump detection for autonomous machine
US11900629B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2023 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Feb 27, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30261
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In various examples, surface profile estimation and bump detection may be performed based on a three-dimensional (3D) point cloud. The 3D point cloud may be filtered in view of a portion of an environment including drivable free-space, and within a threshold height to factor out other objects or obstacles other than a driving surface and protuberances thereon. The 3D point cloud may be analyzed—e.g., using a sliding window of bounding shapes along a longitudinal or other heading direction—to determine one-dimensional (1D) signal profiles corresponding to heights along the driving surface. The profile itself may be used by a vehicle—e.g., an autonomous or semi-autonomous vehicle—to help in navigating the environment, and/or the profile may be used to detect bumps, humps, and/or other protuberances along the driving surface, in addition to a location, orientation, and geometry thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.