Substrate, manufacturing method, and power module with same
US11901114B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2020 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Oct 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M3/1584
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.