Patent · US Active

Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology

US11901149B2 · kind B2 · utility

0Cited by

8References

14Claims

0Family size

Assignee

Endress+Hauser SE+Co. KG · DE

Inventors

Bernd Strütt · Steinen, DE
Dietmar Birgel · Schopfheim, DE
Silke Czaja · Schopfheim, DE

Key dates

Filing date	Aug 3, 2020
Grant date	Feb 13, 2024
Priority date	—
Expiry date	Dec 10, 2040

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.