Wafer processing apparatus and wafer processing method
US11901212B2 · kind B2 · utility
0Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Dec 4, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.