Semiconductor structure, display panel and manufacturing method of electronic element module
US11901479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2021 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Dec 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of an electronic element module is provided. The method includes: disposing a plurality of first microelectronic elements on a first temporary substrate; and replacing at least one defective microelectronic element of the first microelectronic elements with at least one second microelectronic element. The first microelectronic elements and at least one second microelectronic element are distributed on the first temporary substrate. The first microelectronic elements and at least one second microelectronic element have same properties, and at least one of the appearance difference, the height difference and the orientation difference exists between the first microelectronic elements and at least one second microelectronic element. A semiconductor structure and a display panel are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.