Nanotwin copper components
US11901585B2 · kind B2 · utility
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2References
21Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 20, 2020 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Aug 12, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.