Electronic device
US11901618B2 · kind B2 · utility
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1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Sep 6, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/07
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.