System for modular liquid spray cooling of electronic devices
US11903171B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 4, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | Aug 5, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20345
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system including a heat exchanger section for re-cooling a heated liquid coolant, a spray cooling section for cooling an electronic equipment; mean for separating said heat exchanger or pump section from said spray cooling section; means for transferring heat generated by the electronic equipment to at least liquid coolant; means for spraying the liquid coolant along the heat transferring means to transfer heat from the electronic equipment to the liquid coolant; wherein the heat transferring means is in an essentially vertical position so that the liquid coolant generally flows downward and is drained by gravity; means for collecting the liquid coolant; means for suctioning the collected liquid coolant; means for pumping the dielectric liquid coolant from the sprayed liquid coolant collecting means and through the liquid coolant spraying means; and means for housing the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.