Method of manufacturing an ultrasonic probe
US11903319B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2022 |
| Grant date | Feb 13, 2024 |
| Priority date | — |
| Expiry date | May 12, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.