Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant
US11904073B2 · kind B2 · utility
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5References
12Claims
0Family size
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Key dates
| Filing date | Oct 27, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Oct 27, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.