Systems and methods for high throughput cutting of sealing elements on packages
US11904490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Nov 21, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65G13/04
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
Systems and methods described herein are optimized for cutting sealing elements on packages using optical radiation. Packages can pass through a cutting device that applies the optical radiation to damage, vaporize, or cut the sealing element (e.g., tape) on the package. The systems and methods control several aspects of the cutting process to adjust throughput, improve efficiency, and reduce line stoppages. Systems can include an in-feed conveyor that orients packages and rejects packages that are out of specification, which can lead to issues such as jamming or damage to the equipment. Systems can include a variable-speed cut conveyor controlled by a computing system to dynamically adjust the speed of packages based upon historical cut quality, environmental measurement data, and height data related to a vertical dimension of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.