High-throughput and small size samples tension, compression, bending test system and method thereof
US11906474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Sep 7, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/0682
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-throughput and small size samples tension, compression, bending test system is disclosed. The system includes a computer unit, a motor and a number of the sample testing modules mounted horizontally or perpendicular to that ground on a workbench. The sample testing modules include a sample testing modules base plate fixedly attached to the workbench, and a ball screw, a displacement sensor, a moving beam, a clamp unit, a linear moving platform unit and a force value sensor arranged on the sample testing modules base plate. A number of the sample testing modules are arrange in parallel on the workbench or uniformly distributed in a circumferential direction with a point on the workbench as a circular center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.