System and method for rapid inspection of printed circuit board using multiple modalities
US11906578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2020 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Dec 22, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V30/19173
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multispectral inspection (MSI) device for analyzing an electronic item having a printed circuit board (PCB). An electronic power supply powers the electronic item in accordance with one or more test vectors. An optical imaging scanner, terahertz (THz) imaging scanner, and a functional imaging scanner are each operative to scan the electronic item. An electronic processor is programmed to scan the various scanners and control the power supply to acquire optical, THz, and functional images of the electronic item. The images are combined to form a standard three-dimensional (3D) signature and artificial intelligence (AI) classifiers are applied to the 3D signature to perform non-destructive analyses of the electronic item.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.