High-throughput optical sectioning three-dimensional imaging system
US11906723B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Jun 11, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/1787
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-throughput optical sectioning three-dimensional imaging system which includes: a light beam modulation module configured to modulate a light beam into a modulated light beam capable of being focused on a focal plane of an objective lens and being defocused on a defocusing plane of the objective lens; an imaging module configured to employ a camera to image, in different rows of pixels, a sample under illumination of the modulated light beam; a cutting module configured to cut off an imaged surface layer of the sample; a demodulation module configured to demodulate a sample image of one sample strip of one surface layer into an optical sectioning image, and reconstruct the optical sectioning image of each sample strip of each surface layer into a three-dimensional image. The present disclosure achieves imaging of a whole sample by dividing the sample into at least one surface layer, dividing the at least one surface layer into at least one sample strip, and imaging each sample strip. When a multi-layer imaging cannot be performed, the imaged part can be cut off by the cutting module to realize imaging of any layer of the sample, thereby improving the imaging speed and efficie…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.