Patent · US Active

Approach for characterizing propagation of metallic short cracks and long cracks

US11907624B2 · kind B2 · utility

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6Claims
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Key dates

Filing dateNov 2, 2022
Grant dateFeb 20, 2024
Priority date
Expiry dateNov 2, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2111/10
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for characterizing propagation of metallic short cracks and long cracks includes: acquiring crack tip opening displacement in a metallic notched sample under cyclic loading; acquiring crack tip opening displacement amount caused by a single monotonic tensile in the notched sample, and crack tip opening displacement caused by monotonic tensile in the notched sample under a maximum far-field stress; and based on an original Shyam model, constructing, according to the crack tip opening displacement amount and the crack tip opening displacement by obtaining yield strength of metals, a Tmφc model for characterizing the propagation of short cracks and long cracks, where the Tmφc model is used for representing the growth rate of short cracks and long cracks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.