Dual interface metallic transaction cards and methods of manufacturing the same
US11907787B2 · kind B2 · utility
0Cited by
28References
10Claims
0Family size
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Key dates
| Filing date | Apr 22, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Apr 22, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07769
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dual interface transaction card for contact and contactless transactions including an anodized top metal layer. The arrangement of layers allowing for high conductivity metals such as aluminum to be used without compromising the contactless function of the card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.