Method and system for three-dimensional profiling of an object
US11908173B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | May 6, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V10/757
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A first set of pixels forming a first set of rows and a first set of columns of a first image acquired by an image acquisition device is received. A first corrected set of pixels forming a first corrected set of rows and a first corrected set of columns is generated from the first set of pixels. Successive pixels of each row from the first corrected set of rows correspond to successive parallel lines in a plane defined by the sheet of light that are equally spaced along a first axis of a world coordinate system. Successive pixels of each column from the first corrected set of columns correspond to successive parallel lines in the plane defined by the sheet of light that are equally spaced along a second axis of the world coordinate system. Based on the first corrected set of pixels, a first set of points of the sheet of light is determined. The first set of points of the sheet of light is used to obtain a three-dimensional profile of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.