Multilayer ceramic electronic component and method of manufacturing the same
US11908626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Nov 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/252
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes a ceramic body including a laminate body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer, and a first internal electrode and a second internal electrode stacked in the third direction with the dielectric layer interposed therebetween, a first and a second margin portion; a first connection portion and a second connection portion. The first connection portion includes a first lead electrode connected to the first internal electrode, and the second connection portion includes a second lead electrode connected to the second internal electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.