Multilayer electronic component
US11908627B2 · kind B2 · utility
1Cited by
8References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Aug 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes a body including a dielectric layer and an internal electrode, an external electrode disposed outside the body, and an insulating layer disposed on the external electrode. The external electrode is disposed to cover an exposed surface of an outermost surface of the electrode layer, and is formed to have a thickness, equal to or less than a thickness of the body, and the insulating layer is disposed to cover an end of the external electrode, to improve moisture resistance reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.