Light-emitting diode package and electronic device including the same
US11908982B2 · kind B2 · utility
0Cited by
44References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 29, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Oct 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A light-emitting diode (LED) package includes an LED chip on a substrate, an adhesive phosphor film on the LED chip, a cell lens on the adhesive phosphor film, and a lateral reflective layer covering respective lateral surfaces of the LED chip, the adhesive phosphor film, and the cell lens, a lateral surface of the lateral reflective layer being coplanar with a lateral surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.