Endcap for establishing electrical bonding connection
US11909154B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Mar 7, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R11/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A bonding endcap for use in connection with a bracket assembly for establishing an equipotential plane in a cable runway includes a spring clip and a bonding lug. The spring clip is made from an electrically conductive material and has two side walls that extend forward from a rear wall. The bonding lug is made from an electrically conductive material and includes a contact portion and a side arm extending at each side of the contact portion. The spring clip is positionable within a channel of a cable runway rail. The contact portion of the bonding lug is receivable between the side walls of the spring clip to deflect the side walls and establish an electrical bonding connection from the cable runway rail, through the spring clip, and to the bonding lug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.