Electronic device including heat dissipation structure
US11910516B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2019 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Jul 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.