Direct-ink-writing method for printing strain gauge array circuit based on insulating strips
US11910536B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Sep 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a direct-ink-writing (DIW) method for printing a strain gauge array circuit, several insulating strips are printed on the upper layer of the first circuit layer after the first circuit layer has been printed and cured, and the second circuit layer is then printed at the insulating strips. The functional layer of a strain gauge is printed and covered thereon without contacting the insulating strips; the head and tail electrodes of the functional layer are respectively connected to two layers of circuit layers; and finally, a layer of insulating material is printed for encapsulation. DIW is used to complete the whole printing. A new insulating method is used in a cross part of two silver lines of a row-column compound circuit. The local glue dispensing is changed to printing the insulating strips in routing regions, and ensures the strain transmission efficiency from the strain gauge substrate to the functional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.