Assembly of printed circuit board with overmolded epoxy to baseplate
US11910544B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2022 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | May 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A control unit having a connection structure for connecting components of the control unit to a base plate which eliminates the need for separate fasteners. The control unit includes circuitry mounted to a PCB, and the PCB is pre-assembled to a base plate, to form a pre-assembly. During assembly, the PCB and the base plate are aligned when placed in a tooling device which clamps and holds the pre-assembly in place during the over molding process. The circuitry is over molded with an epoxy material, such that the epoxy material flows from a top side of the PCB to underneath the base plate, and the PCB is fixed to the base plate without the use of fasteners such as screws, or adhesive materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.