Liquid cooling device and manufacturing method thereof
US11910564B2 · kind B2 · utility
0Cited by
4References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 10, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Oct 7, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2255/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A liquid cooling device includes a thermally conductive base, a cover, and a metallic partition. The thermally conductive base has a fluid chamber and a plurality of fins. The fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber. Every two of the fins located adjacent to each other define a channel therebetween. Distal ends of at least part of the fins located away from the inner surface together form a covering structure partially coving the channels. The metallic partition is located between and welded to the covering structure and the cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.