Quantum dot composition including a quantum dot, and a ligand having a head portion, a connecting portion including a metal, and a tail portion
US11910703B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jan 19, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Mar 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/40
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A quantum dot composition includes a quantum dot, and a ligand bonded to a surface of the quantum dot, wherein the ligand includes a head portion bonded to the surface of the quantum dot, a connecting portion connected to the head portion and including a metal, and a tail portion coordinated to the metal of the connecting portion. The quantum dot composition according to the present embodiments is used to form an emission layer of a light emitting element, and may thus increase service life and luminous efficiency of the light emitting element including the emission layer formed using the quantum dot composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.