Method and apparatus for poling polymer thin films
US11910715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2021 |
| Grant date | Feb 20, 2024 |
| Priority date | — |
| Expiry date | Sep 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/857
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has multiple grounding electrodes, grounding pads located at its edges, and a polymer thin film including multiple areas each covering only one grounding electrode. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a shadow mask below the poling source, and a Z-elevator to raise the workpiece carrier toward the shadow mask and poling source. When the workpiece in the workpiece carrier is raised to contact the underside of the shadow mask, multiple openings of the shadow mask expose only the corresponding multiple thin film areas of the workpiece to the plasma; meanwhile, conductive grounding terminals on the underside of the shadow mask electrically connect the grounding pads of the workpiece with carrier electrodes on the workpiece carrier, to ground the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.