Dimpled joint for guidewire
US11911051B2 · kind B2 · utility
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56References
13Claims
0Family size
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Key dates
| Filing date | Oct 31, 2019 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Aug 18, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61M2205/0266
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A guidewire for use in intravascular procedures has a solder or weld joint at a distal end thereof. A plurality of dimples are formed on the solder/weld joint to increase the engagement and penetration of fibrous material including chronic total occlusions (CTO).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.