Test element support
US11911768B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2019 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Nov 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1115
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test element support comprises a heating element for heating a test element for analytical examination of a sample. The heating element comprises a substrate, which is made of at least one substrate material. The substrate comprises at least one active area configured for being heated and at least one non-active area outside the active area. The active and the non-active areas are separated by at least one thermal insulation element. The thermal insulation element has a lower thermal conductivity than the substrate material. The thermal insulation element is fully or partially embedded into the substrate. The test element support further comprises at least one heater. The heater comprises at least one heater substrate and the heater substrate is attached to the substrate, wherein the heater substrate is attached to a back face of the substrate. The back face opposes a front face of the substrate contacting the test element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.