Systems for thermal forming an object
US11911929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2022 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Dec 15, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29B2013/027
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems for thermal forming an object are provided. In some embodiments, a system for thermal forming an object using a mold includes one or more processors, and memory including instructions that, when executed by the one or more processors, cause the system to perform the following operations: receiving a mold identifier identifying the mold; determining mold process information for forming the object based on the mold identifier; inserting a material into a heating area, the material having a geometry selected based on the mold process information; heating the material using one or more independently controllable heat sources; and forming the object by disposing the heated material over or into at least a portion of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.