Package accommodating heat dissipation substrate and packing box
US11912489B2 · kind B2 · utility
0Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2019 |
| Grant date | Feb 27, 2024 |
| Priority date | — |
| Expiry date | Jun 19, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D81/203
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.