Patent · US Active

Micromechanical sensor unit and method for manufacturing a micromechanical sensor unit

US11912565B2 · kind B2 · utility

0Cited by

3References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Christoph Hermes · Kirchentellinsfurt, DE
Kerrin Doessel · Stuttgart, DE
Thomas Friedrich · Bietigheim-Bissingen, DE

Key dates

Filing date	Dec 17, 2019
Grant date	Feb 27, 2024
Priority date	—
Expiry date	Apr 28, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/053
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical sensor unit, including: a substrate and an edge layer, which is situated on the substrate and laterally frames an inner area above the substrate; at least one diaphragm, which spans the inner area and forms a covered cavity above the substrate; at least one support point, which is situated between the substrate and the diaphragm inside the cavity and attaches the diaphragm to the edge layer and/or to the at least one support point. The support point separates the diaphragm into at least one measuring area that is movable through force action and at least one reference area that is not movable through force action. The substrate and the diaphragm, inside the cavity, include electrodes, which face one another in the measuring area and the reference area.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.